gold wire造句

• Specifications for fully automatic gold wire ball bonder
  全自动金丝球焊接机技术条件
• Gold wire for semiconductor devices lead bonding
  半导体器件键合金丝
• As a contrast object , gold wire ball bonding technology was also studied
  金丝球键合作为对比研究对象引入本文研究范围。
• Method for determining impurities in gold wire for semiconductor lead bonding by icp - aes
  键合金丝中杂质元素的icp - aes测定方法
• It shows that the immunosensor using gold wire is more sensitive and more stable
  其中，以金丝为基底制备的免疫传感器最灵敏、最稳定。
• As for the immunosensor made of gold wire , the following research has been conducted
  对以金丝为基底制备的免疫传感器进行了如下三方面的研究。
• The change of potential from beginning to end ( the potentiometric difference , a e ) is made of quantifying parameter . different substrates such as gold planar , gold wire and silver wire is used to fabricate this immunosensor
  用自组装单分子膜( sams )技术在金片、银丝、金丝等不同的基底上固定igg抗体，分别制备了电位型无标记igg免疫传感器。
• The machine is the warp machine which can use variety of materials , particularly applicable to gold wire and silver wire production according to user requirements , the golden , silver thread can be for cored wire or outsourcing wire
  该机是一种多种原料用途的包复丝机，特别适用于金（银）丝生产，可根据用户要求，将金（银）丝作芯丝或外包丝使用。
• Copper wire ball bonding is a new technology which is expected to replace the traditional gold wire ball bonding and is of great significance in reducing the cost and improving the reliability of microelectronic components
  铜丝球键合是一种有望取代现行金丝球键合工艺的新技术,这一技术对于降低微电子元器件的成本、提高元器件的可靠性具有重要意义。
• The machine is the warp machine which can use variety of materials , particularly applicable to gold wire silver wire production according to user requirements , the golden , silver thread can be for cored wire or outsourcing wire
  该机是一种多种原料用途的包复丝机，特别适用于金（银）丝生产，可根据用户要求，将金（银）丝生产，可根据用户要求，将金（银）丝作芯丝或外包丝使用。
• 4 . a novel amperometric sensor has been constructed for the determination of h2o2 . it was based on catalyzing electroreduction of hydrogen peroxide by metal hexacyanoferrate , which were electrodeposited on gold wire electrodes , under a certain potential
  利用循环伏安法，在金电极表面电化学沉积一层铁氰酸镍膜（ nihcf ） ，在一定电位条件下，它能快速催化还原过氧化氢，其响应电流与过氧化氢的浓度呈线性关系。
• Contained within the egg is a detachable surprise - - a basket of delicate spring flowers , each carved from a single piece of white quartz fashioned with gold wire stem and stamens , jade leaves and green garnet centers
  彩蛋的里面还另有玄妙，让人叹为观止：在这枚小小的水晶蛋里面还有一个盛满精美花朵的花篮，每一朵花都是由一块白色的石英雕刻而成的，花茎和花蕊由金线制成，叶子由玉石制成，而叶子的中心则是绿色的石榴石。
• The whole process of copper wire ball bonding and gold wire ball bonding were compared and analyzed , and a central composite design of experiment ( doe ) approach was applied to optimize the parameters of free air ball formation process and bonding process , separately
  本文首先对比分析了铜丝球键合和金丝球键合的全过程,采用实验设计分别对烧球工艺参数和键合工艺参数进行了优化。在此优化参数下,获得了连接良好的铜丝球键合点和金丝球键合点。